Product introduction
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Reflow Oven Soldering
The reflow oven soldering process is a common means of attaching electronic components to printed circuit boards during assembly. It is also an integral part of surface mount technology (SMT) assembly, a process that is increasingly used in modern electronics manufacturing.
During reflow soldering, solder paste is applied to the PCB pads where components will be installed. It consists of tiny solder particles suspended in flux. During the reflow process, flux is used to clean surfaces and promote solder wetting.
Technical Parameters
| Effectively heating space | 280mm*190mm)*2 heating zone ,H>80mm |
| Oven size (LxWxH) | 2530*1630*1960mm |
| Weight | 1500 kgs |
| Chamber | With 2 chamber, Heating chamber, cooling chamber |
| Compatible Process | Solder paste and Preform solder |
| Gas | Nitrogen; Formic acid |
| Track | ength:330mm,Adjustable;Height:950+20mm;Carring capacity≥20kg |
| Height of Chamber |
80mm |
| Max temperature of Preheating zone and Reflow zons | 400°C;Accuracy:±1°C |
| Bottom welding temperature | 400°C |
| Top welding temperature | Max 300°C |
| Heating way | Bottom contact-type heating conduction |
| Cooling way | Bottom contact-type cooling |
| Min Vacuum | Preheating zone/Reflow zone/ Cooling zone≤1mbar; Within2h≤5mbar |
| Speed of Heating and Cooling | Max heating speed≥3°C/s; Max cooling speed≥3°C/s |
| Accuracy of Soldering temperature | Temperature of Reflow tray:+2% |
| Max hold time of reflow temperature |
60min,(Max: 999s) |
| Void Rate | Whole Void rate ≤2% Chip size (10mm*10mm),Sigle Void rate≤1% ,Chip size:(10mm*10mm) |
| Cooling Water | With independent circulating cooling water system |
| lemperature curve | Can setting self,(Add/Modify/Delete and so on) |
| Chamber with watch window | Chamber with watch window |
| Power | Max:12KW Working powe:6-8KW |
| Heating platform | Red copper special treatment |
| Power standard | 380V,50HZ/60HZ,3-phase five-wire,10 square copper wire |
| Gas | Nitrogen ,Formic acid |
| Control system | Siemens PLC control system+ YanHua IPC +Software operate |
Our Advantages
· Effective solution for low temperature at platform edges and large temperature difference between edges and center.
· Improved platform temperature uniformity and longevity of usage.
· Long-term stability with temperature uniformity within ±2℃.
· It can solve the issue of chip displacement during rapid pressure reduction.
· During the vacuum evacuation of molten solder, it enables better control of the evacuation speed to reduce void formation.
Frequently Asked Questions
1. What is a vacuum solder reflow oven?
A vacuum solder reflow oven, or vacuum reflow soldering system, is a specialized type of reflow soldering equipment. It incorporates a vacuum environment during soldering. Using this technology, reflow soldering can be enhanced for certain applications or for components sensitive to oxygen and air. This is also true for components that require enhanced control.
In a standard reflow oven, soldering occurs in a controlled atmosphere, typically nitrogen or nitrogen/hydrogen. As a result of this controlled atmosphere, solder and metal surfaces are not oxidized during reflow. This results in a more reliable and high-quality solder joint.
Air or oxygen exposure during can adversely affect some advanced electronic components, such as MEMS (Micro-Electro-Mechanical Systems) devices. A vacuum solder creates an oxygen-free environment in such cases.
2.Why choose HTV China vacuum soldering system?
The HVT Company is a verified supplier of reflow ovens,vacuum solder reflow oven, nitrogen reflow ovens, and reflow soldering machines.
HVT was founded in 2007, headquartered in Tongzhou, Beijing, covering 20000 square meters. As a high-tech company, we specialize in the development and research of vacuum welding machines and semiconductor package production lines.As a result of adhering to the core concept of"Honesty & Innovation & Intelligent & Manufacturing Responsibility,"we studied domestic and foreign advanced experiences and solved the void rate problem and hermetic package problems completely. All of our customers praise our products.
Additionally, we established a research & development center in cooperation with the IGBT industry alliance and
universities and institutes dedicated to developing a package of power devices and semiconductor electronic devices, obtaining a series of patents, including 10 practical patents, 10 software patents, and 15 patents in application.
