Product introduction
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Formic Acid Vacuum Reflow Oven KD-V300
Our formic acid vacuum reflow oven be good at working for igbt power device with formic acid and nitrogen, effectively reduce the void rate , prevent the products from oxidation.
Technical Parameters
| Dimensions | Approximately 3200x1850x1900mm |
| Weight | Appro 2600 kg |
| Effective soldering area | (280mm*190mm)*2 |
| Furnace height | 80mm |
| Tray heating rate | Up to 4°C/s |
| Tray cooling rate | Up to 3°C/s |
| temperature uniformity | ≤2% |
| Ultimate vacuum | 10Pa |
| Bottom soldering temperature | ≤450°C |
| Power rating | Maximum power: 28 kw, working power: 8-10 kw |
| Heating platform | Made of special treated copper |
| Power supply standards | 380V, 50Hz/60Hz, three-phase five-wire system, 10-square-copper wire |
| Gas supply | Nitrogen system, formic acid system (other atmospheres optional) |
| Platform load capacity | 15Kg |
| Application fields | Application fields: IGBT power devices, photovoltaic devices, automotive ele-ctronic device assembly, MMIC hybrid circuit packaging, microwave modules, hermetic package sealing for tubes, MEMS devices, high-power, etc. |
| Control method | Siemens PLC Control System + Yanhua IPC+Software |
| Monitoring windows | Monitoring windows: 3 |
| Actual temperature | Configured with product temperature measurement interface for |
| curve | actualtemperature monitoring of products |
| Interfaces | Ethernetcommunication interface |
| Chamber over-temperature alarm and extreme temperature protection | |
| Cooling water pressure detection system with low-pressure alarm and software prompt | |
| Air pressure detection system with high and low-pressure alarms and software prompt | |
| Chamber door position detection protection | |
| Isolation of electrical components from water-cooling and air-circuit components | |
| One-button power cutoff for the heating section | |
Features Of Void-Free Reflow Oven
· Void-free solder connections
· Soldering with preforms and/or pastes
· Process temperatures up to 300 °C
· Controlled temperature gradients
· Short cycle times
· Separate soldering and cooling chamber
· Flux-free soldering with formic acid
· Reproducibility of the soldering results
· Traceability
· Permanent process control
· Viewing system
· Independent temperature control system
Our Advantages
KD-V300, as an automated online system for mass production, has been upgraded and optimized from Pink's VADU300KL/400X to the KD-V300. In comparison to Pink, we have the following advantages over them:
1.Temperature control advantage: Our product features 9 heating rods on the bottom heating plate, grouped into sets of 3, each with an independent control system. This effectively addresses the issue of low temperature at platform edges and a significant temperature difference between the edges and the center. As a result, our product provides more uniform heating, ensuring consistent temperature across the platform and improving soldering quality.
2.Flexible workflow: During the working process, if any issues arise, our machine automatically stops, allowing for problem analysis. If the problem does not affect soldering quality, operators can select any segmented process to continue the work, saving time and materials. In more serious cases, alternative materials can be selected directly. This flexibility enhances workflow efficiency and reliability.
3.Vacuum control advantage: Our product allows for the adjustable vacuum speed between 0-100%, addressing the issue of chip displacement during rapid pressure reduction. Additionally, during the vacuum evacuation of molten solder, it enables better control of the evacuation speed, reducing void formation. This ensures improved control and quality during the soldering process.
Frequently Asked Questions
1. What is an IGBT power device vacuum soldering system?
IGBT power device vacuum soldering systems are specialized equipment for soldering IGBT power devices in a vacuum environment. In addition to preventing oxidation and ensuring high-quality solder joints, this system creates an oxygen-free atmosphere during soldering.devices can be improved in reliability and performance with vacuum soldering, msoldering. This makesakesfor sensitive electronic applications, such as power electronics, motor drives, and renewable energy systems. In addition to ensuring precise soldering, it minimizes the riskdefect risk, to robust and efficient electronic components.
2.What are the benefits of using a vacuum soldering system for IGBT power devices?
Using a vacuum soldering system for IGBT power devices offers several significant benefits:
· Oxidation prevention: IGBT power devices are designed to ensure high-quality solder joints and long-term reliability through a vacuum environment, which eliminates oxygen.
· Improved solder wetting: Solder wetting is more consistent resulting in stronger and more consistent connections between the IGBT and the PCB.
· Reduced Void Formation: Vacuum soldering helps reduce void formation in the solder joints, which is crucial for maintaining thermal and electrical conductivity, enhancing the overall performance of the IGBT power devices.
· Enhanced ElectricaPeelectrical performance: IGB devices power losses and improved efficiency when there are fewer voids and improved solder quality.
· Hermetic Sealing: Vacuum soldering can achieve hermetic sealing of the IGBT power devices, preventing the entry of moisture or contaminants, which is especially crucial for applications in harsh environments.
· Soldering of Sensitive Components: As IGBTs are sensitive to high temperatures and atmospheric conditions, vacuum soldering allows precise control over the soldering process, reducing trisk of damage tthe risk device.sk.
· Consistency and Reproducibility: The vacuum soldering process ensures uniform solder joints across multiple IGBT power devices in a production batch, ensuring consistent and reproducible results.
