IGBT power devices, diodes, transistors, TO packaging, and photovoltaic devices.

Automotive electronic device assembly, power module packaging, and drive module packaging

MMIC hybrid circuit packaging, microwave modules, and fiber optic device packaging, including gold-tin solder chip bonding

Hermetic sealing of tube shells and lid sealing

Chip integrated circuit packaging, MEMS device

LED flip-chip soldering, MiniLED, MicroLED, UVLED stage lights, automotive lights, and more

Wafer solder ball plating, steel solder ball plating, silver sintering process equipment