Product introduction
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Automotive Electronic Deveice Soldering Machine Kd-V10N
Interested in high-performance automotive electronic device soldering machines, hot air nitrogen reflow oven with 10 zones, IGBT modules solder paste reflow ovens, or automotive led vacuum nitrogen reflow ovens, Our vacuum reflow soldering systems are fully customizable.
Technical Parameters
| Heating parameter | |
| Heating zone | Up 10 / Down 10 |
| Heating zone length | 3600mm |
| Cooling zone quantity | Up 4 / Down 4 |
| Vacuum chamer parameter | |
| Vacuum chamber | One |
| Product size | Minimum product size 150*150mm；Maximum product size 300*350mm |
| Ultimate vacuum | 10-100pa |
| Vacuum pumping speed | Adjustable 60m³/h |
| Flux recovery system | Reduce equipment maintenance frequency, increase accessory lifespan |
| System control | Software operation control + Industrial Siemens PLC control system |
| Process control actions | Vacuum pumping time, vacuum pressure, vacuum pumping speed, vacuum maintenance time, and venting time can be freely controlled and set. |
| Transmission parameters | |
| Mesh width | 450mm |
| Range of adjustment for conveyor rails | 50-400mm |
| Conveyor direction | L-R |
| Transport height | Chain 900+20mm |
| Conveying method | Chain-driven transport |
| Conveying speed | 300-2000mm/min |
| Control section parameters | |
| Power supply | Three-phase five-wire 380V 50/60Hz |
| Startup power | 52Kw |
| Standard power | Approx.10KW |
| Heating-up time | 20 minutes UPS power outage protection |
| Temperature control range | Room temperature to 350°C |
| Temperature control method | PID closed-loop control, driven by SSR |
| Temperature control precision | ±1°C |
| Temperature distribution difference on PCB board | 士3°C |
| Cooling method | Cooling water |
| Alarm | Temperature abnormality (excessive temperature after constant temperature) |
| 3-color light indication | Tricolor signal indicator light: Yellow - Heating up, Green - Constant temperature, Red - Abnormal |
| Weight | Approx.2800kg |
| Overall dimensions | L7200mm*W1630mm*H1650mm |
| Exhaust air volume of requirement | 10 cubic meters/min,2 channels with a diameter Φ180mm |
| Nitrogen protection | Nitrogen flow rate of 20-30 cubic meters per hour;Oxygen concentration of 500-800 parts per million (PPM) |
| External water cooling system | Power of 3 phase; Cooling rate of ≥3-6°C/sec |
Test platform temperature uniformity
· Six-point test: Temperature measuring copper blocks are distributed at different positions on the platform.
· Test result: Temperature uniformity at six positions is less than 4°.
Main function of automotive led nitrogen reflow oven
· In electronics manufacturing, reflow soldering involves attaching surface-mounted components to a printed circuit board (PCB) with solder paste. The components are placed on the PCB after solder paste is applied. As the PCB is heated, the solder melts and flows, creating a bond between the components and the PCB.
· Reflow soldering involves several steps. First, solder paste is applied to the PCB using a stencil or dispensing tool. The components are then placed on top of the paste using automated equipment or by hand. In a reflow oven, the PCB is heated until the solder paste melts and flows, creating a bond between the components and the PCB.
· Compared to other soldering methods, reflow soldering has many advantages. Using this highly automated process, human error is reduced and production efficiency is maximized. Additionally, it ensures that the components and PCB arebonded tightly, ensuring long-term reliability.
· The reflow soldering process is widely used in the electronics industry and is an integral part of modern electronics manufacturing.
Led Reflow Oven Advantages
· Effective solution for low temperature at platform edges and large temperature difference between edges and center.
· Improved platform temperature uniformity and longevity of usage.
· It can solve the issue of chip displacement during rapid pressure reduction.
· During the vacuum evacuation of molten solder, it enables better control of the evacuation speed to reduce void formation.
Frequently Asked Questions
1. What is a hot air soldering machine ?
A hot air soldering machine, also known as a hot air rework station or hot air reflow station, is an electronic tool used for soldering and desoldering components on printed circuit boards (PCBs) and electronic assemblies. It utilizes heated air to melt solder and create or remove solder joints during the soldering and desoldering processes. The machine features a hot air nozzle, heating element with temperature control, air flow control, and may include an integrated vacuum pump for desoldering. It is commonly used for SMT rework tasks and delicate component soldering.
2.What is the function of hot air soldering station?
The hot air rework stations send hot air through the device to warm the solder to be removed or resold. This enables an all-in-one station to address these needs without multiple devices. These hot air rework stations come in a variety of sizes to accommodate different printed circuit board sizes.
