Product introduction
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Technical Parameters
| Welding size | Single chamber, Platform size:400*500mm.Welding board size :350*450*100mm*5 |
| Oven size (LxWxH) | 1630mm*1591mm*2162mm |
| Weight | 2600kg |
| Heating Platform | 5-layers metal heating platform ,water-cooled heating integrated structure design |
| Heating way | Bottom red copper platform contact heating +Top infrared lamps assist heating |
| Gas | Nitrogen; Formic acid;H2 |
| Chamber | Each layer heating platform top height 100mm |
| Control system | Siemens PLC control system+YanHua IPC |
| Rated power | 74KW |
| Working power | 68KW |
| Vacuum speed | 90 m³/h |
| Min vacuum | Below 10Pa(Mechanical pump) |
| Temperature range | Room-400℃ |
| Bottom welding temperature | ≥450℃ |
| Platform heating speed | 35-40℃ /min |
| Platform cooling speed | 100-120℃/min |
| Temperature control deviation | ≤±1℃ |
| Temperature evenness | ≤±1% |
| Chamber with watch window | Chamber with watch window |
| Power standard | 380V, 3-phase five-wire |
Process control of a power module device reflow oven
1. Temperature gradient and time of each stage when soldering , can freely programming and save based on needed.
2.Can automatically generate all process curves, and edit the process program.
3.With digital gas mass flow controller, that can accurately control the process gas flow rate.
Temperature correction function
With intelligent temperature correction system ,that can compensate for temperature difference. 900~950 mm(Need same with chip mounter ,can confirm by agreement).
Part of our advantage of multi-layer formic acid soldering reflow oven
1.Independent research vacuum chambers and valves, with rich experience for design , material choose, production process testing.
2.Our technical team with rich experience from SMT to Semiconductor circuit package process, including Product soldering, soldering material, device surface treatment, setting of temperature and vacuum , and others.
3.Company have more than 200 workers ,Technical R&D personnel more than 40,till now with patent of invention 10, practical patents 20,1 software patent, 1 design patent , and patents in apply more than 15.
