Participate the Elexcon international electronic exhibition In Shenzhen 23 to 25 August

The 2023 ELEXCON Shenzhen International Electronics Exhibition and Embedded System Exhibition will launch three major new exhibition areas: the Embedded and AloT Exhibition, the Power and Energy Storage Exhibition, and the SiP and Advanced Packaging Exhibition. It will take place from 23 to 25 August at the Shenzhen Convention and Exhibition Center (Futian).

This exhibition will showcase industry innovations in electric vehicles, power and energy storage, embedded systems and AIoT, SiP and advanced packaging, and over 20 high-level forums, demonstrating global industry trends and future technological developments.

Invited by the Zhuhai Semiconductor Industry Association, HVT Technology  will participate in this exhibition, and we will show our 3-chamber inline Vacuum reflow oven for IGBT power device , and Experimental model Vacuum eutectic furnace KD-V43. And our booth is :No 9 #9C32,welcome to our booth.

Author: Lina Niu