The Difference Between Vacuum Formic Acid Reflow oven and Conventional Reflow oven

Vacuum Formic Acid Reflow oven and Conventional Reflow oven have significant differences in their operation and performance.

Firstly, the Vacuum Formic Acid Reflow oven uses formic acid to remove oxide films from the surface of the soldering materials, resulting in high-quality and reliable solder joints. In contrast, conventional reflow soldering relies on flux to remove oxide films, which can sometimes lead to residual flux residue on the solder joints.
 

Secondly, the Vacuum Formic Acid Reflow oven operates under low-pressure conditions, preventing the oxidation of soldering materials and enhancing the overall quality of the soldering process. In contrast, Conventional Reflow oven occurs in regular atmospheric conditions, which can lead to oxidation of the soldering materials and reduce the quality of the soldering process.
 

Finally, the Vacuum Formic Acid Reflow oven is advantageous for high-reliability soldering applications, including those in the aerospace and defense industries. Conventional Reflow oven is more commonly used for consumer electronics or other applications requiring lower levels of reliability.
 

In summary, Vacuum Formic Acid Reflow oven offers superior performance in terms of reliability and quality of solder joints compared to conventional reflow soldering.

Author: Lina Niu