The main difference between a vacuum reflow oven and a conventional reflow oven

The main difference between a vacuum reflow oven and a conventional reflow oven lies in the operating environment during the soldering process.

In a conventional reflow oven, the soldering process takes place in a standard air atmosphere. The oven heats up the components and solder paste, causing them to melt and reflow to form a secure bond. However, this setup is susceptible to certain issues such as oxidation, solder balling, and void formation due to air entrapment.

On the other hand, a vacuum reflow oven operates in a controlled environment with reduced air pressure. By creating a vacuum, the oven eliminates the presence of air, which significantly minimizes the aforementioned issues. The absence of air helps prevent oxidation, reduces the formation of solder balls, and minimizes voids in the solder joints.

Overall, the vacuum reflow oven provides a more controlled and reliable soldering environment, leading to improved solder joint quality and reduced defects compared to a conventional reflow oven.

Non-vacuum

Welding effect under nitrogen protection

Vacuum+ Methane acid process

Welding effect under Nitrogen protection

Author: Lina Niu